Electrical trace interconnect assembly
AssigneeHutchinson Technology Incorporated
InventorsJeffry S. Bennin, Todd Boucher, Jeffrey W. Green, Gary E. Gustafson, Ryan Jurgenson, Brent D. Lien
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AssigneeHutchinson Technology Incorporated
InventorsJeffry S. Bennin, Todd Boucher, Jeffrey W. Green, Gary E. Gustafson, Ryan Jurgenson, Brent D. Lien
Estimating the term…
A trace interconnect assembly for transmitting electrical signals to and from a head assembly in a hard disk drive. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.
A method of manufacture for a trace interconnect conductor suitable for mating with a suspension assembly of the type including flexible and rigid regions and for transmitting electrical signals to and from a head assembly, said method of manufacture comprising the steps of:
A method of manufacturing an interconnect assembly for providing electrical interconnect means to a head suspension assembly, comprising the steps of:
A method of manufacture for a head suspension assembly for positioning a head assembly over a rotating data storage device and for transmitting electrical signals to and from the head assembly, said method of manufacture, comprising the steps of:
A method of manufacture of a head transducer interconnect harness for mounting an interconnect assembly and a head assembly to a suspension assembly in a rotating data storage device, the suspension assembly having rigid and flexible regions, said method of manufacture comprising the steps of:
Dependencies are inferred from the claim text.