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US 5,687,474 AGranted
Method of assembling and cooling a package structure with accessible chip
AssigneeVLSI Technology, Inc.
InventorsAhmad Hamzehdoost, Leonard Lucio Mora
Life of this patent
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AssigneeVLSI Technology, Inc.
InventorsAhmad Hamzehdoost, Leonard Lucio Mora
Estimating the term…
A package for an integrated-circuit includes a package body having a die-cavity formed therein. A die-attach pad is formed in the package body adjacent the die-cavity. An opening is formed in the central portion of the die-attach pad for exposing one side of the integrated-circuit die so that an external cooling media can directly contact the exposed side of the integrated-circuit die. The die-attach pad can be formed as a die-mounting ring adjacent the die-attach cavity. The peripheral edge of the integrated-circuit die is fixed to a mounting surface on the die-mounting ring portion to accommodate direct cooling of the exposed side of the integrated-circuit die. The mounting surface of the die-mounting ring extends beyond the peripheral edge of the integrated-circuit die to accommodate a range of sizes of the integrated-circuit die. The exposed surface of the integrated circuit die is cooled, for example, with a cooling fluid, a heatsink, or a thermo-electric refrigeration unit in contact with the exposed side of the die. The exposed side of the die is coated with a film to provide a seal for the exposed side of the integrated-circuit die.
A method for directly cooling an integrated-circuit die, having a front and back surface, mounted in an integrally formed package assembly comprising the steps of:
A method for directly cooling an integrated-circuit die, having a front and back surface, mounted in an integrally formed package assembly comprising the steps off
A method for directly cooling an integrated-circuit circuit die, having a front and back surface, mounted in an integrally formed package assembly comprising the steps of:
Dependencies are inferred from the claim text.