PMOS memory cell with hot electron injection programming and tunnelling erasing
AssigneeProgrammable Microelectronics Corporation
InventorShang-De Ted Chang
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AssigneeProgrammable Microelectronics Corporation
InventorShang-De Ted Chang
Estimating the term…
A P-channel MOS memory cell has P+ source and drain regions formed in an N-well. A thin tunnel oxide is provided between the well surface and an overlying floating gate. In one embodiment, the thin tunnel oxide extends over a substantial portion of the active region and the device. An overlying control gate is insulated from the floating gate by an insulating layer. The device is programmed via hot electron injection from the drain end of the channel region to the floating gate, without avalanche breakdown, which allows the cell to be bit-selectable during programming. Erasing is accomplished by electron tunneling from the floating gate to the N-well with the source, drain, and N-well regions equally biased. Since there is no high drain/well junction bias voltage, the channel length of the cell may be reduced without incurring and destructive junction stress.
A semiconductor memory cell comprising:
A semiconductor memory cell comprising:
A semiconductor memory cell comprising:
A method of programming a floating gate P-channel memory cell having a P+ source and a P+ drain formed in an N-type well region, said method comprising the steps of:
A method of programming a floating gate P-channel memory cell having a P+ source and a P+ drain formed in an N-type well region, said method comprising the steps of:
A method of programming a floating gate P-channel memory cell having a P+ source and a P+ drain formed in an N-type well, said method comprising the steps of:
A method of erasing a floating gate P-channel memory cell having a P+ source and a P+ drain formed in an N-type well, said method comprising the steps of:
Dependencies are inferred from the claim text.