Device and method for aligning a laser

A mechanism for aligning a laser movably secured to a semiconductor process tool, comprising:

• a semiconductor process tool having first and second apertures extending into a chamber;
• a translucent member sealingly covering each said first and second aperture;
• a laser movably coupled onto the outside of said chamber in alignment over the translucent member-covered first aperture;
• a laser alignment device configured to receive light emitted from the movably coupled laser, is coupled onto the outside of said chamber in alignment over the translucent member-covered second aperture;
• and
• a power source coupled to said laser for generating, during use, a laser beam extending completely through said chamber from said laser to said laser alignment device.

A method for aligning a laser coupled within a particle detector device of a semiconductor process tool, comprising:

• providing a semiconductor process tool having a translucent member sealingly coupled over a pair of spaced apertures extending into a chamber;
• movably connecting a laser over one of said pair of member-covered apertures and connecting a terminal
• housing over the other of said pair of member-covered apertures;
• covered apertures;
• connecting a laser alignment device within said terminal housing, said laser alignment device having an alignment mark formed thereon configured to receive light generated by the laser;
• moving said laser to align a laser beam extending from said laser such that said laser beam impinges upon the laser alignment device at the position at which the alignment mark is formed;
• and
• replacing said laser alignment device with a terminating element having an outer circumference equivalent to said laser alignment device.

A method for aligning a laser coupled within a particle detector device of a semiconductor process tool, comprising:

• providing a semiconductor process tool having a translucent member sealingly coupled over a pair of spaced apertures extending into said chamber;
• movably connecting a laser over one of said pair of member-covered apertures and connecting a terminal housing over the other of said pair of member-covered apertures;
• connecting a laser alignment device within said terminal housing, said laser alignment device having an alignment mark formed thereon;
• moving said laser to align a laser beam extending from said laser such that said laser beam impinges upon the laser alignment device at the position at which the alignment mark is formed;
• replacing said laser alignment device with a terminating element having an outer circumference equivalent to said laser alignment device;
• and
• arranging a path of particles through said chamber, wherein said particles arise during semiconductor wafer fabrication, and wherein said path of particles are arranged to traverse said laser beam.