Known good die test apparatus and method
OwnerShaw Wei Leeinventor
Life of this patent
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Abstract
An apparatus and method for testing an integrated circuit chip prior to mounting on a package including a non-conductive tape upon which are formed a plurality of contacts arranged in a pattern matching the arrangement of bonding pads of an integrated circuit, and a z-axis conductor placed over the conductive tape. The target chip is placed on the z-axis conductor and test signals are transmitted between the contacts on the tape and the bonding pads of the integrated circuit through conductors embedded in the z-axis conductor. In one embodiment, a glass or ceramic plate including openings, arranged in the same pattern as the bonding pads, is placed between the integrated circuit and the z-axis conductor to prevent damage to the integrated circuit.
Claims13
An apparatus for testing an integrated circuit chip prior to mounting on a package, the integrated circuit chip including a plurality of bonding pads arranged in a predetermined pattern, the apparatus comprising:
- a plurality of contacts arranged in the predetermined pattern;
- a substrate positioned over the plurality of first conductors, the substrate having opposing first and second surfaces and including plurality of conductors extending between the first surface and the second surface, the first surface being mounted on the plurality of contacts;
- and
- a non-conductive plate having a plurality of openings arranged in the predetermined pattern, the non-conductive plate being mounted on the second surface of the substrate;
- wherein when the integrated circuit chip is pressed against the non-conductive plate, at least one of the conductors protrudes through each opening and contacts one of the bonding pads, thereby providing an electrical connection between each of the plurality of contacts and an associated one of the bonding pads.
A method for testing an integrated circuit chip prior to mounting on a package, the integrated circuit chip including a plurality of bonding pads arranged in a predetermined pattern, the method comprising:
- providing a plurality of contacts arranged in the predetermined pattern;
- positioning a substrate over the plurality of first conductors, the substrate having opposing first and second surfaces and including plurality of conductors extending between the first surface and the second surface, the first surface being mounted on the plurality of contacts;
- positioning a non-conductive plate having a plurality of openings arranged in the predetermined pattern over the second surface of the substrate;
- pressing the integrated circuit chip against the non-conductive plate such that at least one of the conductors protrudes through each opening and contacts one of the bonding pads, thereby providing an electrical connection between each of the plurality of contacts and an associated one of the bonding pads;
- and
- applying test signals to the plurality of contacts.
Dependencies are inferred from the claim text.