Load board enhanced for differential pressure retention in an IC test head

Abstract

A load board for an IC test apparatus has a film of self-supporting material mounted by adhesive to one side of the load board, covering through-holes in the load board, but exposing contact pads on the surface to which the self-supporting film is mounted. In preparing the load board, a self-supporting film is cut to shape for the load board, and openings are made in areas where contact pads must be exposed to make contact with off-board circuitry. The film is then mounted to the load board by adhesive, which may be applied in conventional ways, such as by spraying or spreading. In some embodiments film is used that has a pre-applied adhesive and a protective film layer over the adhesive. In these embodiments, the protective film is peeled away, and the film is applied to the load board.

Dependencies are inferred from the claim text.