Integrated circuits comprising interconnecting plugs

An integrated circuit comprising:

• an active area formed relative to a semiconductor substrate;
• an electrically conductive line;
• a dielectric insulating layer positioned intermediate the electrically conductive line and the active area;
• an interconnecting plug extending through the insulating layer and electrically interconnecting the line with the active area, the interconnecting plug comprising an electrically conductive annular ring;
• and
• an electrically insulating annular ring positioned radially inward of the electrically conductive annular ring.

An integrated circuit comprising:

• an elevationally inner electrically conductive node;
• an elevationally outer electrically conductive node discrete from the inner electrically conductive node;
• a dielectric insulating layer positioned intermediate the inner and outer nodes;
• an interconnecting plug extending through the insulating layer and connecting the inner and outer nodes in ohmic electrical connection, the interconnecting plug comprising an electrically conductive annular ring and
• an electrically insulating annular ring positioned radially inward of the electrically conductive annular ring.

An integrated circuit comprising an electrically conductive interconnecting plug electrically connecting between at least two different elevation circuit nodes, the integrated circuit comprising:

• a first lower elevation node;
• a second higher elevation node;
• and
• an interconnecting plug comprising:
• an outer electrically conductive ring in electrical contact with the first and second nodes;
• an electrically insulating ring laterally surrounded by the outer electrically conductive ring;
• an inner electrically conductive ring laterally surrounded by the electrically insulating ring;
• and
• a non-annular substantially solid mass within the inner electrically conductive ring.

An integrated circuit comprising an electrically conductive interconnecting plug electrically connecting between at least two different elevation circuit nodes, the integrated circuit comprising:

• a first lower elevation node;
• a second higher elevation node;
• and
• an interconnecting plug comprising:
• an outer electrically conductive ring in electrical contact with the first and second nodes;
• and
• an inner electrically conductive ring laterally surrounded by the outer electrically conductive ring.

An integrated circuit comprising an interconnecting plug, the interconnecting plug comprising:

• an outer electrically conductive ring;
• an electrically insulating ring laterally surrounded by the outer electrically conductive ring;
• an inner electrically conductive ring laterally surrounded by the electrically insulating ring;
• and
• a non-annular substantially solid mass within the inner electrically conductive ring.

An integrated circuit comprising an interconnecting plug, the interconnecting plug comprising:

• an outer electrically conductive layer;
• a first electrically insulating layer laterally surrounded by the outer electrically conductive layer;
• an inner electrically conductive layer laterally surrounded by the first electrically insulating layer;
• and
• a second electrically insulating layer laterally surrounded by the inner electrically conductive layer.