Package for electrical components having a molded structure with a port extending into the molded structure

A package for electrical components, comprising:

• a support structure having a first side, a second side, and an electrical component receiving area;
• at least one lead having a first end and a second end, the at least one lead extending into the support structure from the first side and having a vent hole adjacent thereto and extending into the support structure, wherein the first end is external to the support structure;
• and
• at least one tab having a first end and a second end, the at least one tab extending into the support structure from the second side, wherein the first end is external to the support structure, and wherein the at least one tab is electrically isolated from the electrical component receiving area and the at least one lead.

A pressure sensor device, comprising:

• a lead-support structure having a first sidewall, a second sidewall, an electrical component receiving area, and a vent hole extending therein;
• an electrical component mounted in the electrical component receiving area;
• a first lead having an interconnect bonding end coupled to a surface mount end by a central portion, the lead extending through the first sidewall and adjacent the vent hole;
• and
• a tab having a surface mount end and a fastening end, wherein the fastening end cooperates with the lead-support structure to fasten the tab to the lead-support structure, and wherein the tab is electrically isolated from the electrical component receiving area.