Adjustable fixture for use with a wire pull tester
AssigneeVLSI Technology, Inc.
InventorFredrick James Vanderlip
Life of this patent
Estimating the term…
Abstract
A fixture for use with a wire pull tester that tests the strength of a bond between an electrical contact of a semiconductor device and a wire affixed to the electrical contact. The fixture comprises a device support, a mounting surface provided on the device support, and a port provided at the mounting surface. The device support includes a height adjustment mechanism. The mounting surface is configured to engage a surface of the semiconductor device and includes a port with which an air pressure differential is produced to maintain engagement between the mounting surface and the semiconductor device surface when a pull force provided by a wire pulling member of the tester is imparted to the wire affixed to the electrical contact of the semiconductor device.
Claims17
A fixture for use with a tester that tests a strength of a bond between an electrical contact of a semiconductor device and a wire affixed to the electrical contact, the tester including a wire pulling member, and the fixture comprising:
- a device support, comprising a lower support section and an upper support section engaging the lower support section, wherein the engagement between the lower support section and the upper support section is alterable to permit engagement between the wire of the semiconductor device and the wire pulling member of the tester;
- a mounting surface provided on the upper support section of the device support and configured to engage a surface of the semiconductor device;
- and
- a port provided at the mounting surface of the device support with which an air pressure differential is produced to maintain engagement between the mounting surface and the surface of the semiconductor device when a pull force provided by the wire pulling member of the tester is applied to the wire of the semiconductor device.
An apparatus for performing a wire pull test, comprising:
- a tester including a wire pulling member;
- a semiconductor device engaged by the wire pulling member during the test, the semiconductor device comprising a surface, an electrical contact, and a wire affixed to the electrical contact;
- a device support for holding the semiconductor device during the test, comprising:
- a stand including a height adjustment mechanism to move the semiconductor into proximity with the pulling member of the tester;
- a mounting surface provided on the stand and configured to engage the surface of the semiconductor device;
- and
- a port provided at the mounting surface of the device holder with which an air pressure differential is produced to maintain engagement between the mounting surface and the surface of the semiconductor device when a pull force provided by the wire pulling member of the tester is imparted to the wire affixed to the electrical contact of the semiconductor device.
A fixture for use with a tester that tests a strength of a bond between an electrical contact of a semiconductor device and a wire affixed to the electrical contact, the tester including a wire pulling member, and the fixture comprising:
- a device support;
- a mounting surface provided on the device support and configured to engage a surface of the semiconductor device;
- a height adjustment mechanism to move the semiconductor device placed on the mounting surface into proximity with the pulling member of the tester;
- and
- a port provided at the mounting surface with which an air pressure differential is produced to maintain engagement between the mounting surface and the surface of the semiconductor device when a pull force provided by the wire pulling member of the tester is imparted to the wire affixed to the electrical contact of the semiconductor device.
Dependencies are inferred from the claim text.