Method for manufacturing a semiconductor device having a heat radiator

A method for producing a semiconductor device comprising:

• providing a heat radiator having a surface bounded by outer edges, a semiconductor element mounted on the surface inwardly of and spaced from the outer edges, an insulator mounted on the surface of the heat radiator, the insulator defining a space along the surface between an inner edge of the insulator and the semiconductor element, and a plurality of leads of a lead frame disposed over the surface of the heat radiator, the plurality of leads contacting the insulator, each of the plurality of leads having a leading edge disposed inwardly from the inner edge of the insulator toward the semiconductor element, each of the plurality of leads having an inner portion between the inner edge of the insulator and a corresponding leading edge, the inner portion overlying the space between the inner edge of the insulator and the semiconductor element and spaced from the surface of the heat radiator by the insulator;
• connecting a first end of each wire of a plurality of wires to the inner portion of each of a subset of the plurality of leads and connecting a second end of each wire of the plurality of wires to the semiconductor element;
• and
• sealing the semiconductor element, the plurality of wires, the heat radiator, the insulator and the lead frame with resin, wherein the first end of each wire of the plurality of wires is connected to the inner portion of each of the subset of the plurality of leads by pressing an end of the inner portion closest to the semiconductor element against the heat radiator using a lead presser.