Method of forming an applicator for applying tacking media to a circuit substrate
AssigneeMotorola, Inc.
InventorsBarry B. Groman, Anthony B. Suppelsa, Scott Potter
Life of this patent
Estimating the term…
Abstract
An applicator (300) provides a tool for depositing processing media (510), such as a tacky flux agent, on predetermined surface areas (715) of a circuit substrate (705). The applicator (300) has a portion formed from a flexible compressible material with a surface (302, 325) patterned to have projections (325) that correspond in location to the predetermined surface areas (715) of the circuit substrate (705). The applicator (300) is preferably formed by polymerizing resin material using an image that corresponds to the circuit substrate (410, 420, 430).
Claims9
A method for forming an applicator for applying tacking media to a circuit substrate, the method comprising the steps of:
- forming a negative image defining radiation transparent portions that correspond to surface areas of a circuit substrate designated to receive tacking medium;
- and
- forming at least a portion of the applicator including the step of exposing unpolymerized resin to radiation, using the negative image, to form an applicator surface patterned with projections that correspond in location to the surface areas of the circuit substrate.
A method for forming an applicator for applying tacking media to a circuit substrate, the method comprising the steps of:
- forming a negative image substrate defining radiation transparent portions that correspond to surface areas of a circuit substrate designated to receive tacking medium;
- placing unpolymerized resin in a radiation transparent frame such that the unpolymerized resin has first and second opposing surfaces;
- exposing the first surface to radiation to generate a flat portion of polymerized resin;
- exposing the second surface to radiation through the negative image substrate, until portions of polymerized resin, that correspond to the radiation transparent portions, are formed that extend from the second surface to the first surface;
- and
- removing unpolymerized resin from around the portions of polymerized resin to form an applicator surface patterned with projections that correspond in location to the surface areas of the circuit substrate.
Dependencies are inferred from the claim text.