Thin film wiring board
AssigneesHitachi, Ltd., Hitachi Chemical Company, Ltd.
InventorsTakao Miwa, Masahiro Suzuki, Akio Takahashi, Yoshiaki Okabe, Yuichi Satsu, Shin Nishimura
Life of this patent
Estimating the term…
Abstract
A thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10.sup.7 to 10.sup.2 dyne/cm.sup.2 during heat curing thereof is suitable for forming an adhesive film used in a thin film wiring board having excellent heat resistance and high reliability.
Claims6
A thin film wiring board comprising a plurality of base films having the wiring patterns thereon and one or more adhesive layers placed between base films, said adhesive layers being made from a thermosetting resin composition consisting essentially of
- (A) a polyimide, that is thermosetting and has a modulus of elasticity of 10.sup.5 dyne/cm.sup.2 or more at 300.degree. C. and containing repeating units of the formula:
- ##STR11## wherein R is an alkyl group, a fluorinated alkyl group, an alkoxy group, a fluorinated alkoxy group, or a halogen atom;
- n is zero or an integer of 1 or 2;
- and m is zero or an integer of 1 to 4, in an amount of 30% by weight or more based on the total weight of the polyimide component, and
- (B) a bismaleimide compound of the formula:
- ##STR12## wherein X is a divalent organic group having at least two carbon atoms, and
- said thermosetting resin composition showing a modulus of elasticity of 10.sup.7 dyne/cm.sup.2 to 10.sup.2 dyne/cm.sup.2 during heat curing thereof.
Dependencies are inferred from the claim text.