Integrated circuit scribe line structures and methods for making same

A multi-layer structure comprising:

• a substrate;
• a first layer disposed over said substrate, said first layer having an elongated opening therein having a first width;
• a second layer disposed over said first layer, said second layer having an elongated opening therein having a second width, said second width being larger than said first width;
• a third layer disposed over said second layer and covering edges of said first and second layers exposed during formation of said openings in said first and second layers;
• and
• a fourth layer disposed over said third layer, said layer having an elongated opening therein having a third width, said third width being larger than said second width, wherein said first, second, third, and fourth layers form a scribe line having a pair of sloped sidewalls.

A multi-layer structure comprising:

• a substrate;
• a first layer disposed over said substrate, said first layer having an elongated opening therein having a first width;
• a second layer disposed over said first layer, said second layer having an elongated opening therein having a second width, said second width being larger than said first width;
• a third layer disposed over said second layer, said third layer having an elongated opening therein having a width substantially the same as said second width;
• a fourth layer disposed over said third layer, said fifth layer having elongated opening therein having a third width, said third width being larger than said second width;
• and
• a fifth layer disposed over said fourth layer, said fifth layer having an elongated opening therein having a width substantially the same as said third width, wherein said first, second, third, fourth, and fifth layers form a scribe line having a pair of sloped sidewalls.