Method of forming an electrically conductive contact on a substrate
AssigneeCirco Craft Co., Inc.
InventorsAlain Langevin, Benoit Auger, Charles Casavant, Wolfgang Erat
Life of this patent
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Abstract
A method of forming an electrically conductive contact on an insulated substrate such as a printed circuit board includes the step of defining a contact area on the substrate and applying a copper buss on the substrate so that it extends beyond the marginal edges of the contact area. A thin layer of soldermask is then applied to cover the upper surface of the copper buss outside of the contact area and to cover areas of the substrate not covered by the copper buss. Thereafter, a Thick Film Polymer (TFP) conductive paste is applied over the exposed portions of the copper buss and over a small portion of the soldermask so that the copper buss is covered completely.
Claims9
A method of forming a contact on a substrate comprising the steps of:
- (i) applying a conductive buss onto the substrate;
- (ii) applying soldermask to selected areas onto a surface of the conductive buss;
- (iii) defining a window by the soldermask on an upper surface of the conductive buss, the window having a periphery which is disposed inwardly from all marginal edges of the conductive buss;
- and
- (iv) applying a conductive paste on the upper surface of the conductive buss to substantially completely cover the window.
Dependencies are inferred from the claim text.