Method for melt-molding Ge, Si, or Ge-Si alloy
AssigneesTokyo Denshi Yakin Co., Ltd., Toshio Ohzono
InventorsKoichi Kawasaki, Toshio Ohzono
Life of this patent
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Abstract
Ge, Si or a Ge-Si alloy are melt-molded to form, for example an optical lens, by heating Ge, Si or a Ge-Si alloy to at least its melting point, and heating a molding die to a temperature above that melting point. The molten material is injected at a predetermined pressure into a cavity of the heated molding die, and then the melt is cooled at that pressure to a temperature just above a temperature at which the melt solidifies. The pressure on the melt is then decreased, and the melt is cooled to the temperature at which it solidifies. The pressure on the solidified melt is increased, and the solidified melt is cooled. After releasing the pressure on the cooled solidified melt, the optical lens, or other molded article, is removed from the die.
Claims4
A method for melt-molding Ge, Si or a Ge-Si alloy, which comprises:
- heating a material consisting of Ge, Si or a Ge-Si alloy to at least the melting point of the material;
- heating a molding die to a temperature above the melting point of the material;
- injecting the molten material at a predetermined pressure into a cavity of the heated molding die;
- cooling the molten material at the predetermined pressure in the cavity of the heated molding die to a temperature just above the temperature at which the material solidifies;
- decreasing the pressure on the molten material in the cavity of the molding die and cooling the molten material to the temperature at which the material solidifies;
- increasing the pressure on the solidified material in the cavity of the molding die to the predetermined pressure and cooling the solidified material;
- and
- releasing the pressure on the solidified material and separating the solidified material from the molding die.
Dependencies are inferred from the claim text.