Wafer structure in a semiconductor device manufacturing process

A wafer structure for a semiconductor device manufacturing process, comprising;

• a semiconductor wafer having a plurality of semiconductor structures thereon that are separated from each other by scribing lines extending lengthwise and widthwise between said plurality of semiconductor structures such that adjacent ones of said semiconductor structures confront each other across a width of a scribing line extending therebetween,
• wherein one of said semiconductor structures has one of said scribing lines separating said one of said semiconductor structures from another of said semiconductor structures adjacent thereto,
• wherein said one of said scribing lines has a first area having a first length and a first width between said one and said other of said semiconductor structures, a second area having a second length and a second width between said one and said other of said semiconductor structures, and a third area having a third length and a third width between said one and said other of said semiconductor structures, wherein said second and third widths are each larger than said first width, and
• wherein at least one recess is defined in at least one of said one and said other of said semiconductor structures, said second and third areas partially contained within said at least one recess;
• and
• a first alignment mark within said second area.

A semiconductor device structure, comprising;

• a device area having a semiconductor structure on a semiconductor wafer;
• a scribing area surrounding said device area and defining at least one scribing line extending lengthwise therein and adjacent said device area, said scribing area having a first edge extending lengthwise and contiguous with said device area, a second edge extending lengthwise and contiguous with said device area and a third edge extending lengthwise and contiguous with said device area, wherein said second and third edges are each spaced further from said scribing line than said first edge;
• a first alignment mark located between said second edge and said first edge;
• a second alignment mark located between said third edge and said first edge;
• a first film covering said second edge so as to partially cover said first alignment mark between said second edge and said first edge, said first film having an edge adjacent to said first edge.