Lead frame for use in a resin-sealed type semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsTsutomu Nakazawa, Yumi Inoue
Life of this patent
Estimating the term…
Abstract
A lead frame for use in a resin-sealed type semiconductor device, comprising an outer frame, a plurality of leads supported by the outer frame, arranged side by side and each composed of an inner lead and an outer lead, a die pad arranged inside the outer frame and located so that the tips of the inner leads are close to the die pad and oppose the die pad, and a resin flow-control body. The resin flow-control body has been formed by extending a portion of the outer frame toward the die pad through a space formed in the outer frame. The body is designed to be placed in a cavity of a mold having a gate communicating with the cavity, with the space located between the gate and the cavity, in order to form a resin sealing body.
Claims29
A lead frame for use in a resin-sealed type semiconductor device, comprising:
- an outer frame;
- a plurality of leads supported by said outer frame, arranged side by side and each composed of an inner lead and an outer lead;
- a die pad arranged inside the outer frame and located so that tips of the inner leads are close to the die pad and oppose the die pad;
- and
- a resin flow-control body having a portion of said outer frame extending toward said die pad through a space formed in said outer frame, the resin flow-control body designed to be placed in a cavity of a mold having a gate communicating with the cavity, and shaped to evenly distribute injected resin to upper and lower portions of the cavity, with said space located between said gate and said cavity, in order to form a resin sealing body.
A lead frame for use in a resin-sealed type semiconductor device, comprising:
- an outer frame;
- a plurality of leads supported by said outer frame, arranged side by side and each composed of an inner lead and an outer lead;
- and
- a resin flow-control body having a corner of said outer frame extending toward a corner of a substantially square semiconductor chip, the resin flow-control body designed to be placed in a cavity of a mold having a gate communicating with the cavity, and shaped to evenly distribute injected resin to upper and lower portions of the cavity, with said space located between said gate and said cavity, in order to form a resin sealing body.
Dependencies are inferred from the claim text.