Acoustic transducer chip
AssigneeThe Charles Draper Laboratory, Inc.
InventorJonathan J. Bernstein
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Abstract
A wafer and a method of making a wafer containing a plurality of severable transducer chips includes a wafer; a plurality of transducer chips formed on the wafer; and a grid of longitudinal and latitudinal grooves in the wafer for separating the chips from each other and enabling them to be easily, individually severed from the wafer, as well as a transducer chip and a method of making it, having integral raised contacts adapted for a flip chip or beam lead interconnection, with a transducer formed on the chip; and a plurality of raised contacts integrally formed with the chip and electrically interconnected with the transducer.
Claims4
An acoustic transducer chip having integral, raised contacts comprising:
- at least one acoustic transducer chip;
- an acoustic transducer formed on said chip;
- and
- a plurality of raised contacts integrally formed with said chip and electrically interconnected with said acoustic transducer;
- wherein each of said raised contacts is located proximate an edge of said chip and extending above and beyond the edge of said chip.
Dependencies are inferred from the claim text.