Curable resin composition

A curable resin composition comprising:

• (a) an oxyalkylene polymer having a number average molecular weight (Mn) of 3000 or more and an Mw/Mn ratio of 1.6 or less comprised of
• (i) a group represented by the formula (3):
• ##STR7## wherein R is an divalent alkylene group of 2 to 4 carbon atoms and m is an integer;
• (ii) at least one reactive silicon group of the formulae (1) or (2):
• ##STR8## wherein R.sup.1 and R.sup.2 are independently:
• a straight, branched or cyclic alkyl group of 1 to 20 carbon atoms, an aryl group of 6 to 20 carbon atoms, an aralkyl of 7 to 20 carbon atoms, or a triorganosiloxy group of the formula:
• (R.sup.1).sub.3 SiO--, wherein each R' may be the same or different and represents phenyl or monovalent hydrocarbon group of 1 to 20 carbon atoms;
• may be the same or different and is a hydroxyl group or a hydrolyzable group:
• a is 0 or an integer from 1 to 3;
• b is 0, 1 or 2;
• and a +.SIGMA.b.gtoreq.1;
• (b) a curing catalyst comprised of at least one reactive silicon group per molecule of the formula (1) or (2) as described above;
• (c) an epoxy resin;
• and
• (d) a ketimine.