Hermetic sealing composition
AssigneesAsahi Glass Company, Limited, Iwaki Glass Company Ltd.
InventorsRyuichi Tanabe, Satoshi Rokudai, Yuichi Kuroki, Akira Nakamura
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Abstract
A hermetic sealing composition comprising 100 parts by weight of a basic composition consisting of from 80 to 99.9 wt % of a crystalline low melting glass powder containing lead and boron and from 0.1 to 20 wt % of a low expansion ceramic filler, and from 0.001 to 1.0 part by weight, in total, of at least one of an .alpha.-4PbO.B.sub.2 O.sub.3 crystal powder and a Pb.sub.3 O.sub.4 powder, incorporated to the basic composition, the thermal expansion coefficient of the sealing composition after firing being from 80.times.10.sup.-7 to 105.times.10.sup.-7 /.degree.C. within a range of from room temperature to 300.degree. C.
Claims11
A hermetic sealing composition comprising 100 parts by weight of a basic composition consisting of from 80 to 99.9 wt % of a crystalline low melting glass powder containing lead and boron and from 0.1 to 20 wt % of a low expansion ceramic filler, and from 0.001 to 1.0 part by weight, in total, of an .alpha.-4PbO.B.sub.2 O.sub.3 crystal powder and a Pb.sub.3 O.sub.4 powder, incorporated to the basic composition, the thermal expansion coefficient of the sealing composition after firing being from 80.times.10.sup.-7 to 105.times.10.sup.-7 /.degree.C. within a range of from room temperature to 300.degree. C.
Dependencies are inferred from the claim text.