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US 5,683,942 AGranted
Method for manufacturing bump leaded film carrier type semiconductor device
AssigneeNEC Corporation
InventorsKeiichiro Kata, Shuichi Matsuda, Eiji Hagimoto
Life of this patent
Estimating the term…
Abstract
An insulating film has conductive layers on a first surface and conductive protrusions on a second surface. The conductive layers are connected to the conductive protrusions via through holes provided in the insulating film. A semiconductor chip having pads is adhered by an adhesive layer to the insulating film. Then, the conductive layers are locally pressured, so that the conductive layers are electrically connected to respective ones of the pads.
Claims52
A method for manufacturing a semiconductor device, comprising the steps of:
- preparing an insulating film having a first surface on which conductive layers are formed and a second surface on which conductive protrusions connected through said insulating film to respective ones of said conductive layers are formed, said insulating film also having openings therethrough, said openings being covered with respective said conductive layers,
- preparing a semiconductor chip having pads located opposite respective said openings and a passivation film located so that said pads are surrounded by said passivation film, a surface of said pads being less distant from said semiconductor chip than a surface of said passivation film,
- adhering said semiconductor chip to said insulating film by an adhesive layer so that said openings oppose respective said pads through respective said conductive layers, and
- locally bending said conductive layers by inserting a bonding tool into said openings and pressing said conductive layers with said bonding tool, thereby electrically connecting said conductive layers with respective said pads.
1 more element
A method for manufacturing a semiconductor device, comprising the steps of:
- preparing an insulating film having a first surface on which conductive layers are formed, said insulating film also having openings therethrough, said openings being covered with respective said conductive layers;
- preparing a semiconductor chip having pads located opposite respective said openings and a passivation film located so that said pads are surrounded by said passivation film, a surface of said pads being less distant from said semiconductor chip than a surface of said passivation film;
- adhering said semiconductor chip to said insulating film by an adhesive layer to that said openings oppose respective said pads through respective said conductive layers;
- and
- locally bending said conductive layers by inserting a bonding tool into said openings and pressing said conductive layers with said bonding tool, thereby electrically connecting said conductive layers with respective said pads.
2 more elements
A method for manufacturing a semiconductor device, comprising the steps of:
- preparing an insulating film having first surface and second surfacers and through holes therethrough, conductive layers being formed on said second surface, conductive protrusions being formed on said conductive layers, conductive members being formed in said through holes and being connected to respective ones of said conductive layers, said insulaing film also having openings therethrough, said openings being covered with respective said conductive layers;
- preparing a semiconductor chip having pads located opposite respective said openings and a passivation film located so that said pads are surrounded by said passivation film, a surface of said pads being less distant from said semiconductor chip than a surface of said passivation film;
- adhering said semiconductor chip to said insulating film by an adhesive layer so that said openings oppose respective said pads through respective said conductive layers, and
- locally bending said conductive members by inserting a bonding tool into said openings and pressing said conductive layers with said bonding tool, thereby electrically connecting conductive members with respective said pads.
1 more element
A method for manufacturing a semiconductor device, comprising the steps of:
- preparing an insulating film having first and second surfaces and through holes therethrough, conductive layers being formed on said second surface, conductive members being formed in said through holes and being connected to respective ones of said conductive layers, said insulating film also having openings therethrough, said openings being covered with respective said conductive layers;
- preparing a semiconductor chip having pads located opposite respective said openings and a passivation film located so that said pads are surrounded by said passivation film, a surface of said pads being less distant from said semiconductor chip than a surface of said passivation film;
- adhering said semiconductor chip to said insulating film by an adhesive layer so that said openings oppose respective said pads through respective said conductive layers;
- and
- locally bending said conductive members by inserting a bonding tool into said openings and pressing said conductive layers with said bonding tool, thereby electrically connecting said conductive members with respective said pads.
2 more elements
A method for manufacturing a semiconductor device, comprising the steps of:
- preparing an insulating film having a first surface on which conductive layers are formed and a second surface on which conductive protrusions connected through said insulating film to respective ones of said conductive layers are formed,, said insulating film having a resin injection opening at a center portion thereof, said insulating film also having openings therethrough, said openings being covered with respective said conductive layers;
- preparing a semiconductor chip having pads located opposite respective said openings and a passivation film located so that said pads are surrounded by said passivation film, a surface of said pads being less distant from said semiconductor chip than a surface of said passivation film;
- combining said semiconductor chip having pads with said insulating film so that said openings oppose respective said pads through respective said conductive layers;
- locally bending said conductive layers by inserting a bonding tool into said openings and pressing said conductive layers with said bonding tool, thereby electrically connecting said conductive layers with respective said pads;
- and
- injecting resin via said resin injection opening into a gap between said insulating film and said semiconductor chip.
3 more elements
A method for manufacturing a semiconductor device, comprising the steps of:
- preparing an insulating film having a first surface on which conductive layers are formed, said insulating film having a resin injection opening at a center portion thereof, said insulating film also having openings therethrough, said openings being covered with respective said conductive layers;
- preparing a semiconductor chip having pads located opposite respective said openings and a passivation film located so that said pads are surrounded by said passivation film, a surface of said pads being less distant from said semiconductor chip than a surface of said passivation film;
- combining said semiconductor chip with said insulating film so that said openings oppose respective said pads through respective said conductive layers;
- locally bending said conductive layers by inserting a bonding tool into said openings and pressing said conductive layers with said bonding tool, thereby electrically connecting said conductive layers with respective said pads;
- and
- injecting resin via said resin injection opening into a gap between said insulating film and said semiconductor chip.
3 more elements
A method for manufacturing a semiconductor device, comprising the steps of:
- preparing an insulating film having first and second surfaces and through holes therethrough, conductive layers being formed on said second surface, conductive protrusions being formed on said conductive layers, conductive members being formed in said through holes and being connected to respective ones of said conductive layers, said insulating film having a resin injection opening at a center portion thereof, said insulating film also having openings therethrough, said openings being covered with respective said conductive layers;
- preparing a semiconductor chip having pads located opposite respective said openings and a passivation film located so that said pads are surrounded by said passivation film, a surface of said pads being less distant from said semiconductor chip than a surface of said passivation film;
- combining said semiconductor chip with said insulating film so that said openings oppose respective said pads through respective said conductive layers;
- locally bending said conductive members by inserting a bonding tool into said openings and pressing said conductive members with said bonding tool, thereby electrically connecting said conductive members with respective said pads;
- and
- injecting resin via said resin injection opening into a gap between said insulating film and said semiconductor chip.
3 more elements
A method for manufacturing a semiconductor device, comprising the steps of:
- preparing an insulating film having first and second surfaces and through holes therethrough, conductive layers being formed on said second surface, conductive members being formed in said through holes and being connected to respective ones of said conductive layers, said insulating film having a resin injection opening at a center portion thereof, said insulating film also having openings therethrough, said openings being covered with respective said conductive layers;
- preparing a semiconductor chip having pads located opposite respective said openings and a passivation film located so that said pads are surrounded by said passivation film, a surface of said pads being less distant from said semiconductor chip than a surface of said passivation film;
- combining said semiconductor chip with said insulating film so that said openings oppose respective said pads through respective said conductive layers;
- locally bending said conductive members by inserting a bonding tool into said openings and pressing said conductive members with said bonding tool, thereby electrically connecting said conductive members with respective said pads;
- and
- injecting resin via said resin injection opening into a gap between said insulating film and said semiconductor chip.
3 more elements
Dependencies are inferred from the claim text.