Reactive ion etched assisted gold post process
AssigneeThe Whitaker Corporation
InventorsKrishna Pande, Olaleye A. Aina, Orlando E. Asuncion, Fred R. Phelleps, Jay Mathews, Richard Dean
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Abstract
A process to fabricate a specified height and cross-section of Microwave Monolithic Integrated Circuit gold posts comprising a patterned conductive substrate overlayed by an adhesive layer, a matrix layer, and a photoresist layer. Using photolithographic techniques, gold post locations are defined in the photoresist layer. m Gold post locations and cross-sections are defined in the matrix layer. The adhesive layer at the gold post locations is removed. The gold post locations are plated to form gold posts. The matrix is etched and the adhesive is dissolved.
Claims5
A method of making gold posts suitable for a microwave monolithic circuit, comprising the steps of:
- applying a conducting surface on an insulating substrate to provide continuity for plating,
- overlying the conducting surface with a semiconductor material having a desired thickness,
- applying a photoresist onto the semiconductor material,
- defining holes at respective locations through the photoresist and the semiconductor material by photolithography followed by etching to remove the semiconductor material,
- plating gold in the holes to create posts of desired height,
- and removing the semiconductor material and the conducting surface on the substrate which surround the posts, leaving the posts directly on the substrate.
Dependencies are inferred from the claim text.