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AssigneeNippon Steel Corporation
InventorsYasushi Hasegawa, Hisashi Naoi, Yuuichi Satoh, Hiroshi Ukeba
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Alloy foils for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere comprise 6.0 to 15.0 percent silicon, 0.1 to 2.0 percent manganese, 0.50 to 30.0 percent chromium, 0.10 to 5.0 percent molybdenum, 0.50 to 10.0 percent vanadium, 0.02 to 1.0 percent niobium, 0.10 to 5.0 percent tungsten, 0.05 to 2.0 percent nitrogen, 0.50 to 20.0 percent phosphorus, plus 0.005 to 1.0 percent carbon, and/or either or both of 0.01 to 5.0 percent titanium and 0.01 to 5.0 percent zirconium, all by mass, with the balance comprising nickel and impurities, and have a thickness of 3.0 to 300 .mu.m. Alloy foils for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere are also available with substantially vitreous structures.
Alloy foil for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere comprising 6.0 to 15.0 percent silicon, 0.1 to 2.0 percent manganese, 0.50 to 30.0 percent chromium, 0.10 to 5.0 percent molybdenum, 0.50 to 10.0 percent vanadium, 0.02 to 1.0 percent niobium, 0.10 to 5.0 percent tungsten, 0.05 to 2.0 percent nitrogen, 0.50 to 20.0 percent phosphorus, all by mass, and the balance comprising nickel and impurities, and having a thickness of 3.0 to 300 .mu.m.
Alloy foil for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere comprising 6.0 to 15.0 percent silicon, 0.1 to 2.0 percent manganese, 0.50 to 30.0 percent chromium, 0.10 to 5.0 percent molybdenum, 0.50 to 10.0 percent vanadium, 0.02 to 1.0 percent niobium, 0.10 to 5.0 percent tungsten, 0.05 to 2.0 percent nitrogen, 0.50 to 20.0 percent phosphorus, 0.005 to 1.0 percent carbon, all by mass, the ratio of carbon to nitrogen in mass percent being less than 1, and the balance comprising nickel and impurities, and having a thickness of 3.0 to 300 .mu.m.
Alloy foil for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere comprising 6.0 to 15.0 percent silicon, 0.1 to 2.0 percent manganese, 0.50 to 30.0 percent chromium, 0.10 to 5.0 percent molybdenum, 0.50 to 10.0 percent vanadium, 0.02 to 1.0 percent niobium, 0.10 to 5.0 percent tungsten, 0.05 to 2.0 percent nitrogen, 0.50 to 20.0 percent phosphorus, at least one selected from the group consisting of 0.01 to 5.0 percent titanium and 0.01 to 5.0 percent zirconium, all by mass, and the balance comprising nickel and impurities, and having a thickness of 3.0 to 300 .mu.m.
Alloy foil for liquid-phase diffusion bonding of heat-resisting metals in an oxidizing atmosphere comprising 6.0 to 15.0 percent silicon, 0.1 to 2.0 percent manganese, 0.50 to 30.0 percent chromium, 0.10 to 5.0 percent molybdenum, 0.50 to 10.0 percent vanadium, 0.02 to 1.0 percent niobium, 0.10 to 5.0 percent tungsten, 0.05 to 2.0 percent nitrogen, 0.50 to 20.0 percent phosphorus, 0.005 to 1.0 percent carbon, at least one selected from the group consisting of 0.01 to 5.0 percent titanium and 0.01 to 5.0 percent zirconium, all by mass, the ratio of carbon to nitrogen in mass percent being less than 1, and the balance comprising nickel and impurities, and having a thickness of 3.0 to 300 .mu.m.
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