Apparatus for multi-component PCB mounting
AssigneeDell USA, L.P.
InventorsBecky Dugan, Darrell J. Slupek
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes a multi-component mounting footprint for mounting one of several possible differently sized discrete component packages on the circuit board. The multi-component mounting footprint includes a first mounting pad which has two connection points for mounting a connector on one of two different sized components. The footprint also includes a second mounting pad which is symmetric to the first mounting pad. About the mounting pads are cut outs which prevent solder buildup when either one of two different sized components are mounted thereon.
Claims14
A circuit board having one of two dissimilar sized component packages mounted thereon, the circuit board comprising:
- a component mounting structure having two connection pads upon which either of said two dissimilar sized component packages are mounted, said connection pads within a predetermined perimeter area, said predetermined perimeter area enclosing said connection pads in a board surface area which is smaller than what would be required if both of said dissimilar sized component packages were mounted to the circuit board, said two connection pads having cutouts on an outer surface to prevent tombstoning when either of said two dissimilar sized component packages are mounted.
A mounting pad on a printed circuit board, for mounting a plurality of components of varying size, the mounting pad comprising:
- a first connector pad, etched on a mounting side of the printed circuit board, said first connector pad having at least two connection points to which said components of varying size may be soldered;
- and
- a second connector pad, etched on the mounting side of the printed circuit board, electrically isolated from said first connector pad, said second connector pad also having at least two connection points to which said components of varying size may be soldered.
A surface component mounting pad for connecting two surface mount components having different dimensions to a printed circuit board, the surface component mounting pad comprising:
- a first connector pad, etched on a mounting side of the printed circuit board, said first connector pad having two connection points comprising:
- a first connection point to which a first connector on a smaller of one of said two surface mount components of varying size may be soldered;
- and
- a second connection point, extending outward from said first connection point, to which a first connector on a larger of one of said two surface mount components of varying size may be soldered;
- a second connector pad, etched on the mounting side of the printed circuit board, said second connector pad having two connection points comprising:
- a first connection point to which a second connector on said smaller of one of said two surface mount components of varying size may be soldered;
- and
- a second connection point, extending outward from said first connection point, to which a second connector on said larger of one of said two surface mount components of varying size may be soldered;
- wherein said first connection pad and said second connection pad are symmetric about an axis which is longitudinal between said first connector pad and said second connector pad.
Dependencies are inferred from the claim text.