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US 5,683,758 AGranted
Method of forming vias
AssigneeLucent Technologies Inc.
InventorsMichael D. Evans, Tae Yong Kim, Henry Miles O'Bryan, Jr.
Life of this patent
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Abstract
A method of forming a via hole in a substrate includes forming an opening in a substrate thereby forming a slag and then heating the substrate to recombine the slag with the substrate.
Claims8
A method of forming a via in a substrate, wherein said substrate is barium titanate of an ivory color, comprising:
- forming an opening in said substrate by exposing said substrate to an energy beam, thereby forming slag in said opening, said slag being adjacent to, but not part of, said substrate;
- heating said substrate to 800.degree. C.-1000.degree. C., thereby causing said slag to recombine with said substrate, resulting in the ivory color;
- and
- depositing a material upon said substrate and within said opening.
1 more element
Dependencies are inferred from the claim text.