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US 5,683,743 AGranted
Manufacturing circuit boards dipped in molten solder
AssigneeInternational Business Machines Corporation
InventorsPeter Michael Banks, William M. Morgan
Life of this patent
Estimating the term…
Abstract
Solder is applied to a circuit structure 7 by dipping the structure into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The structure is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit structure. This is achieved by supporting the structure on a carrier 9 which in turn is attached to a motor shaft 11.
Claims10
A method of manufacturing an interconnect structure, comprising:
- providing a bath of molten solder in which a surface of the solder is covered with a layer of oil;
- maintaining a temperature of the bath at about 220.degree. C.;
- providing a carrier for supporting the structure while at least a part of the structure is in the bath of molten solder;
- immersing at least part of the structure in the solder;
- providing metal pads on the structure;
- rotating the carrier to rotate the structure about an axis approximately perpendicular to a plane of the structure while moving the structure along a path through the solder;
- regulating a rate of rotation of the structure to provide a set thickness of solder deposited on said pads;
- and
- withdrawing the entire structure from the solder bath while an angle between a main axis of the structure and the vertical is between 35 degrees and 55 degrees.
6 more elements
Dependencies are inferred from the claim text.