Process of producing aluminum nitride multiple-layer circuit board

A process of producing a multiple-layer circuit board of aluminum nitride, comprising the steps of:

• preparing green sheets of aluminum nitride;
• forming, on said green sheets, conductor patterns of a conductor paste containing tungsten powder as a main conductor component;
• laminating said green sheets with said conductor patterns formed thereon to form a lamination;
• primary-firing said lamination in a container made of boron nitride at a temperature of at least 1600.degree. C. and in a nitrogen gas atmosphere pressurized to at least three atm.;
• removing the lamination from said container made of boron nitride;
• and
• secondary-firing said primary-fired lamination at a temperature in a temperature range of from 1400.degree. C. to 1600.degree. C. and in a non-oxidizing gas atmosphere not containing carbon.

A process of producing a multiple-layer circuit board of aluminum nitride, comprising the steps of:

• preparing green sheets of aluminum nitride;
• forming, on said green sheets, conductor patterns of a conductor paste containing tungston powder as a main conductor component;
• laminating said green sheets with said conductor patterns formed thereon to form a lamination;
• and
• firing said lamination in a sequence of a primary-firing step and a secondary-firing step, the lamination being placed in a container made of boron nitride solely during the primary firing-step, further comprising:
• in said primary-firing step, firing said lamination in said container made of boron nitride at a temperature of at least 1600.degree. C. and in a nitrogen gas atmosphere pressurized to a level selected to suppress release of boron nitride from the boron nitride container, thereby to prevent any substantial reaction of released boron nitride with the tungsten conductor component of the conductor patterns and resulting formation of tungsten boride producing an increased resistivity of the conductor patterns, and the conductor paste containing a further component comprising aluminum nitride powder in an amount of at least 3 wt % of the weight of the main conductor component, the temperature and the duration of the primary-firing step being selected to achieve a desired high level of thermal conductivity of the fired said lamination, and
• in said secondary-firing step, firing said primary-fired lamination at a temperature in a temperature range of from 1400.degree. C. to 1600.degree. C. and in a non-oxidizing gas atmosphere not containing carbon, the temperature and the duration of the secondary-firing step being selected so as to decompose substantially all of any tungsten boride formed during the primary-firing step and thereby to eliminate said increased resistivity of the conductor patterns produced by the primary-firing step.

A process of producing a multiple-layer circuit board of aluminum nitride, comprising the steps of:

• preparing green sheets of aluminum nitride;
• forming, on said green sheets, conductor patterns of a conductor paste containing tungsten powder as a main conductor component and a further component comprising aluminum nitride powder, selected in respective amounts such that the conductor patterns formed on said green sheets comprise the further component in an amount of at least 3 wt % of the weight of the main conductor component;
• laminating said green sheets with said conductor patterns formed thereon to form a lamination;
• and
• firing said lamination in a sequence of a primary-firing step and a secondary-firing step, the lamination being placed in a container made of boron nitride solely during the primary firing-step, further comprising:
• in said primary-firing step, firing said lamination in said container made of boron nitride at a temperature of at least 1600.degree. C. and in a nitrogen gas atmosphere pressurized to a level selected to suppress release of boron nitride from the boron nitride container, thereby to prevent any substantial reaction of released boron nitride with the tungsten conductor component of the conductor patterns and resulting formation of tungsten boride producing an increased resistivity of the conductor patterns, the temperature and the duration of the primary-firing step being selected to achieve a desired high level of thermal conductivity of the fired said lamination, and
• in said secondary-firing step, firing said primary-fired lamination at a temperature in a temperature range of from 1400.degree. C. to 1600.degree. C. and in a non-oxidizing gas atmosphere not containing carbon, the temperature and the duration of the secondary-firing step being selected so as to decompose substantially all of any tungsten boride formed during the primary-firing step and thereby to eliminate said increased resistivity of the conductor patterns produced by the primary-firing step.