CMP polishing pad conditioning apparatus
AssigneeTexas Instruments Incorporated
InventorEugene O. Hempel, Jr.
Life of this patent
Estimating the term…
Abstract
A conditioning end effector apparatus (10) for conditioning a CMP polish pad (40) includes an end effector (20) for contacting CMP polish pad (40). Holder mechanism (12) includes end effector recess (18) for receiving end effector (20). Spacer mechanism (22 or 22') is also located at predetermined locations in end effector recess (18) to associate with end effector openings (26) in end effector (20). End effector (20) firmly attaches through spacer mechanism (22 or 22') to holder mechanism (12) using a fastening device (24). Because of spacer mechanism (22 or 22'), end effector (20) is at distance from recess face (36) to permit slurry (38) that is deposited on CMP polish pad (40) to pass through end effector openings (26).
Claims20
A method for conditioning a CMP polish pad, comprising the steps of:
- placing a spacer mechansism in at least one predetermined location of a holder mechanism end effector recess;
- placing the spacer mechanism in the end effector recess in positions that associate with selected ones of a plurality of end effector openings in the end effector;
- attaching the end effector through the spacer mechanism to the holder mechanism using a fastening device;
- and
- placing the end effector in contact with a CMP polish pad having a layer of slurry deposited on the CMP polish pad for conditioning the CMP polish pad while the slurry passes through the plurality of end effector openings.
An apparatus for conditioning a CMP polish pad, comprising:
- an end effector for contacting the CMP polish pad;
- a holder mechanism comprising an end effector recess for receiving the end effector;
- a spacer mechanism located at predetermined locations in said end effector recess to associate with a plurality of end effector openings in said end effector;
- and
- a plurality of fastening devices each for passing through said spacer mechanism for attaching said end effector firmly to said holder mechanism.
A method for forming an apparatus for conditioning a CMP polish pad, comprising the steps of:
- forming an end effector for contacting the CMP polish pad;
- forming a holder mechanism comprising an end effector recess for receiving the end effector;
- forming a spacer mechanism located at predetermined locations in the end effector recess for associating with end effector openings in the end effector;
- and
- forming a fastening device firmly attaching the end effector through the spacer mechanism to the holder mechanism at a distance from the holder mechanism.
Dependencies are inferred from the claim text.