Heat exchanger for cooling semi-conductor elements or the like
AssigneeAlusuisse Technology & Management Ltd.
InventorUwe Bock
Life of this patent
Estimating the term…
Abstract
Heat exchanger for cooling semi-conductor elements or such equipment, in particular high capacity cooling unit of extruded aluminum or another light weight metal, featuring cooling fins that are connected to a base plate, are spaced apart from each other and are each in the form of a hollow section with two parallel fin walls connected by transverse struts, where the cooling fin is secured in a groove or like recess in the base plate. A free groove is provided beside each occupied groove in the base plate 14 of the heat exchanger and accommodates a counter-lying cooling fin of a second heat exchanger into the base plate of which the cooling fins of the first heat exchanger engage.
Claims11
Heat exchanger for cooling semi-conductor elements or such equipment, which comprises:
- a first and second heat exchanger, each having a base plate with a plurality of parallel grooves therein, cooling fins on each heat exchanger having a coupling socket on one end and a free end on the opposed end, said cooling fins being connected to said respective base plates wherein said fins are spaced apart from each other and are each in the form of a hollow section with two parallel fin walls connected by transverse struts;
- wherein the coupling sockets of the cooling fins of the first heat exchanger engage in said grooves of said first heat exchanger to form occupied grooves in the first heat exchanger, including a free groove beside each occupied groove;
- and
- wherein the free ends of the cooling fins of said second heat exchanger engage free grooves of the first heat exchanger to provide counter-lying cooling fins of the first and second heat exchanger.
Dependencies are inferred from the claim text.