Recording apparatus and recording head substrate for use in the same

A substrate for use in a recording head on which a plurality of heat generating elements are arranged to generate thermal energy used to record and a plurality of driving integrated circuits are provided to drive the plurality of heat generating elements, said substrate comprising:

• driving wirings supported on said substrate and connecting the heat generating elements to terminals of the driving integrated circuits, said driving wirings extending into at least a portion of a region on said substrate on which the driving integrated circuits are supported and being electrically connected to the driving integrated circuits at positions beneath the driving integrated circuits;
• signal series wirings arranged on the substrate at positions closer to the heat generating elements than said terminals of the driving integrated circuits are to the heat generating elements;
• and
• conductors which are formed at a second region on said substrate, the second region located between adjacent driving integrated circuits for connecting a recording current to the ground,
• wherein said driving wirings, said signal series wirings, and said conductors are all formed in a same layer.

A recording apparatus comprising:

• a recording head having a substrate on which a plurality of heat generating elements as recording elements are arranged and a plurality of driving integrated circuits to drive said plurality of heat generating elements are supported, said substrate including driving wirings supported on said substrate and connecting the heat generating elements to terminals of the driving integrated circuits, said driving wirings extending into at least a portion of a region on said substrate on which the driving integrated circuits are supported and being electrically connected to the driving integrated circuits at positions beneath the driving integrated circuits;
• signal series wirings arranged on said substrate at positions closer to the heat generating elements than said terminals of the driving integrated circuits are to said heat generating elements;
• conductors which are formed at a second region on said substrate, the second region located between adjacent driving integrated circuits for connecting a recording current to the ground;
• and
• conveying means for conveying a recording medium to be recorded by said recording head,
• wherein said driving wirings, said signal series wirings, and said conductors are all formed in a same layer.

A recording apparatus comprising:

• a recording head having a substrate on which a plurality of heat generating elements as recording elements are arranged and a plurality of driving integrated circuits to drive said plurality of heat generating elements are supported, said recording head comprising:
• driving wirings supported on the substrate and electrically connecting the heat generating elements to terminals of the driving integrated circuits, said driving wirings extending into at least a portion of a region on the substrate on which the driving integrated circuits are supported and being electrically connected to the driving integrated circuits at positions beneath the driving integrated circuits;
• and
• conveying means for conveying a recording medium to be recorded upon by said recording head,
• wherein at least two signal series wirings of signal lines for transmitting a recording data and signal lines for transmitting a control signal are arranged on the substrate at positions closer to the heat generating elements than the terminals of the driving integrated circuits are to the heat generating elements.

A recording head assembly comprising:

• an elongated substrate having a side, a longitudinal margin, and an other longitudinal margin;
• a plurality of heat generating elements for generating thermal energy to record, said plural heat generating elements being disposed on the side of said elongated substrate, the plural heat generating elements being arranged in a region of the longitudinal margin of the substrate;
• a plurality of driving integrated circuits which drive said plurality of heat generating elements, said driving integrated circuits being spaced apart from said heat generating elements, the integrated circuits being arranged in a substantially centered manner along the length of the substrate;
• a plurality of wirings which extend from the heat generating elements and electrically connect to the driving integrated circuits;
• a plurality of signal series wirings which serially connect the driving integrated circuits, said signal series wirings being connected in a cascade configuration and being arranged between said integrated circuits in a region of those said integrate circuits on the side thereof nearest the heat generating elements, and which said signal series wirings have terminal connections at said integrated circuits which are covered by said integrated circuits, and terminal connections remote from integrate circuits are arranged in a region of an other longitudinal margin of the substrate;
• and
• a plurality of conductors which are formed in a region on the substrate between adjacent said driving integrated circuits and which conduct recording currents to a ground potential.