Microwave compression interconnect using dielectric filled three-wire line with compressible conductors

A stacked assembly of microwave circuits formed on substrates, comprising:

• a first microwave circuit comprising a first substrate having defined on a first substrate surface a first grounded coplanar waveguide (GCPW) transmission line;
• a second microwave circuit comprising a second substrate having defined on a second substrate surface a second GCPW transmission line;
• and
• an interconnection circuit for providing an orthogonal microwave transition between said first and second GCPW transmission lines, said interconnection circuit comprising:
• a dielectric element having formed therein first, second and third openings extending from a first end of said dielectric element to a second end of said dielectric element;
• and
• first, second and third conductors disposed respectively within said first, second and third openings, said conductors including respectively first, second and third compressible conductor portions, each including a first end protruding from said respective openings to form a first set of compressible contacts at said first end of said dielectric element, said conductors further including respective fourth, fifth and sixth compressible conductor portions each including a first end protruding from said respective openings to form a second set of compressible contacts at said second end of said dielectric element,
• said first and second substrates sandwiching said interconnection circuit so that said first set of compressible contacts of said three-wire transmission line is in compressive electrical contact with corresponding ground plane surfaces and a center conductor comprising said first GCPW line, said second set of compressible contacts of said three-wire transmission line is in compressive electrical contact with corresponding ground plane surfaces and a center conductor comprising said second GCPW line.