Heat sink for plastic casings
AssigneeSGS-Thomson Microelectronics S.A.
InventorJean-Pierre Moscicki
Life of this patent
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Abstract
A heat sink for mounting a semiconductor chip in a plastic casing. The upper surface of the heat sink is in thermal contact with the semiconductor chip, the lower surface is coplanar with a main surface of the casing. The heat sink is formed from a substantially square sheet of metal having each of its corners folded as a tongue to provide a substantially square base, each of the folded tongues forming the lower surface of the base.
Claims32
A heat sink for use in a plastic semiconductor casing, the heat sink being formed from a sheet of metal having a plurality of cut-out sections that define a plurality of tongues extending from a central portion of the sheet, each tongue having at least one edge established by one of the plurality of cut-out sections, each of the plurality of tongues being folded along a corresponding fold line so that its at least one edge overlaps the central portion to form a platform having an upper surface for being in thermal contact with a semiconductor chip, and a lower surface arranged to be coplanar with a main surface of the casing, at least two of the fold lines being nonparallel relative to each other.
A heat sink for mounting a semiconductor chip in a semiconductor casing, the heat sink comprising:
- a platform including an upper portion and a lower portion, the upper portion having an upper surface for mounting a chip thereon, the lower portion having a recess therein for attaching the platform to the semiconductor casing, the platform being comprised of a sheet having a central portion and a plurality of tongues extending from the central portion, the upper portion including the central portion and the lower portion including the plurality of tongues disposed to overlap and to be substantially parallel to the central portion;
- at least one fin coupled to the platform;
- and
- at least one connecting arm coupling the at least one fin to the platform, the connecting arm having ends, one end of the arm being coupled to the platform and the other end being coupled to the fin.
A heat sink for mounting a semiconductor chip in a semiconductor casing, the heat sink comprising:
- a sheet of metal including a central portion and a plurality of tongues extending from the central portion, each of the plurality of tongues being connected to the central portion at a corresponding one of a plurality of fold lines and being folded along its corresponding fold line to overlap the central portion, wherein at least two of the plurality of fold lines are nonparallel relative to each other, and wherein the central portion and the folded tongues establish a platform having an upper surface adapted to mount the semiconductor chip thereon and a lower surface to engage the semiconductor casing.
A semiconductor device comprising:
- a semiconductor chip;
- a semiconductor casing;
- and
- a heat sink including a platform having a first surface on which the semiconductor chip is mounted and a second surface that engages the semiconductor casing, the platform being formed from a sheet of metal having a plurality of cut-out sections that define a plurality of tongues extending from a central portion of the sheet, each of the plurality of tongues having at least one edge established by one of the plurality of cut-out sections, each of the plurality of tongues being folded so that its at least one edge overlaps the central portion to form the platform, at least one of the central portion and one of the plurality of tongues having an aperture extending therethrough, at least a portion of the aperture being disposed on the second surface with a portion of the semiconductor casing extending therethrough to anchor the platform to the casing.
A semiconductor device comprising:
- a semiconductor chip;
- a semiconductor casing;
- and
- a heat sink including a platform comprising an upper portion and a lower portion, the upper portion having an upper surface on which the semiconductor chip is mounted, the lower portion having at least two intersecting recesses therein that receive a portion of the casing to attach the platform to the semiconductor casing, the platform being comprised of a sheet having a central portion and a plurality of tongues extending from the central portion, the upper portion including the central portion and the lower portion including the plurality of tongues disposed to overlap and to be substantially parallel to the central portion.
A heat sink for mounting a semiconductor chip in a semiconductor casing, the heat sink comprising:
- a sheet of metal including a central portion and at least three individual tongues independently extending from the central portion, each of the tongues being connected to the central portion at a fold line and being folded along its fold line to overlap the central portion so that the central portion and the folded tongues establish a platform having an upper surface for mounting a semiconductor chip thereon and a lower surface to engage a semiconductor casing.
Dependencies are inferred from the claim text.