Zirconia-added alumina substrate with direct bonding of copper
AssigneesFuji Electric Co., Ltd., Sumitomo Metal Ceramics Inc.
InventorsMasaharu Nishiura, Shigemasa Saito, Akira Morozumi, Shizuyasu Yosida, Katumi Yamada, Toshio Nozaki, Hiroshi Miyama, Seigo Oiwa, Kazuya Matuura, Kazuhiko Teramura
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Abstract
A ceramic substrate is a high-temperature fired body consisting of alumina as the main component, zirconia, and a ceramics sintering assisting agent. The assisting agent is one of yttria, calcia, magnesia, and ceria, in which yttria is added at 0.1-2 wt %, calcia is added at 0.02-0.5 wt %, magnesia is added at 0.02-0.4 wt %, and ceria is added at 0.02-0.5 wt %.
Claims14
A substrate for a semiconductor device, comprising:
- a ceramic substrate having a material composition including alumina as a main component and zirconia;
- and
- a copper plate bonded to said ceramic substrate,
- wherein said material composition of said ceramic substrate is such that said alumina has a weight proportion of 70% to 90% and said zirconia has a weight proportion of 10% to 30%.
A substrate for a semiconductor device, comprising:
- a ceramic substrate having a material composition including alumina as a main component, zirconia, and at least one additive selected from the group consisting of yttria, calcia, magnesia, and ceria;
- and
- thin copper plates directly bonded to front and back surfaces of said ceramic substrate, respectively.
Dependencies are inferred from the claim text.