Plastic integrated circuit card with reinforcement structure outer to the card and protecting integrated circuit module

A semi-rigid card comprising:

• a semi-rigid body having a first modulus of elasticity, the semi-rigid body having a first surface, a second surface opposite the first surface, and edge surfaces joining the first and second surfaces;
• a module having an electronic component, said module disposed in a first cavity located in the first surface of the semi-rigid body;
• a first reinforcement structure having a second modulus of elasticity, said second modulus of elasticity being higher than said first modulus of elasticity, said first reinforcement structure being connected to the second surface and the edge surfaces of the semi-rigid body;
• and
• a second reinforcement structure having a modulus of elasticity higher than the first modulus of elasticity, the second reinforcement structure connected to the first surface of the semi-rigid body and to the first reinforcement structure, wherein the first and second reinforcement structures substantially enclose the semi-rigid body.

A method of making a semi-rigid card, the method comprising the steps of:

• forming a cavity in a first surface of a semi-rigid body having a first modulus of elasticity, the semi-rigid body having a second surface opposite the first surface and outer edge surfaces connecting the first and second surfaces at an outer perimeter of the semi-rigid body;
• disposing a module having an electronic component in the cavity;
• and
• attaching a first reinforcement structure having a second modulus of elasticity to the second and outer edge surfaces of the semi-rigid body, the second modulus of elasticity being higher than the first modulus of elasticity.

A method of making a semi-rigid card, the method comprising the steps of:

• forming a cavity in a first surface of a semi-rigid body having a first modulus of elasticity, the semi-rigid body having a second surface opposite the first surface and edge surfaces connecting the first and second surfaces;
• disposing a module having an electronic component in the cavity
• attaching a first reinforcement structure having a second modulus of elasticity to the second and edge surfaces of the semi-rigid body, the second modulus of elasticity being higher than the first modulus of elasticity;
• and
• attaching a second reinforcement structure having a modulus of elasticity higher than the first modulus of elasticity to the first surface of the semi-rigid body and to the first reinforcement structure.