Method of using an anisotropically conductive material to locate alignment of a semiconductor substrate
AssigneeMotorola, Inc.
InventorGary Lee Christopher
Life of this patent
Estimating the term…
Abstract
A system for locating electrically conductive features such as device terminals (104) of a semiconductor die device under test (103) includes an array of test terminals (101), an anisotropically conductive material (102) above the array of test terminals (101), and a semiconductor die (103). The array of test terminals has a pitch (203) much smaller than the pitch (204) of the device terminals (104). Individual test terminals (105) of the array of test terminals (101) are scanned to locate the device terminals (104). Once the device terminals (104) are located, the test terminals (105) are configured to send and receive functional signals required for functionally testing the device under test (103).
Claims19
A method for locating alignment of a semiconductor substrate comprising:
- providing the semiconductor substrate comprising an electrically conductive fiducial feature;
- providing a test terminal array comprising a plurality of test terminals;
- providing an anisotropically conductive material over said test terminal array;
- contacting the anisotropically conductive material with the electrically conductive fiducial feature;
- keeping the plurality of test terminals stationary relative to each other;
- switching a test signal from a first one of the plurality of test terminals to a second one of the plurality of test terminals;
- and
- locating the semiconductor substrate when the test signal is channeled to the electrically conductive fiducial feature.
A method for locating device terminals comprising:
- providing a test terminal array comprising test terminals;
- providing an anisotropically conductive material over said test terminal array;
- providing a device under test having the device terminals;
- temporarily contacting the anisotropically conductive material with the device terminals wherein the test terminals remain stationary relative to each other during the step of temporarily contacting the anisotropically conductive material;
- and
- conducting a test signal from a first one of the test terminals into the device terminal wherein the device terminal is aligned when a second one of the test terminals detects the test signal and wherein the second one of the test terminals is adjacent to the first one of the test terminals.
A method for locating alignment of a semiconductor substrate comprising:
- providing the semiconductor substrate comprising an electrically conductive fiducial feature having a fiducial feature diameter;
- providing a test terminal array comprising a plurality of test terminals with a test terminal pitch between each of the plurality of test terminals wherein the test terminal pitch is less than or equal to one third of the fiducial feature diameter;
- providing an anisotropically conductive material over said test terminal array;
- contacting the anisotropically conductive material with the electrically conductive fiducial feature;
- keeping the plurality of test terminals stationary relative to each other;
- switching a test signal from a first one of the plurality of test terminals to a second one of the plurality of test terminals;
- and
- locating the semiconductor substrate when the test signal is channeled to the electrically conductive fiducial feature.
Dependencies are inferred from the claim text.