US 5,672,977 AGranted

Probe apparatus

AssigneesTokyo Electron Limited, Tokyo Electron Yamanashi Limited

InventorMasayuki Yamada

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Abstract

The probe apparatus for a semiconductor wafer has a work table on which a wafer is placed. A printed wiring board having a high rigidity is situated above the work table. A support block is mounted on the printed wiring board so as to pierce through its opening. The support block has a recess which opposes to the work table, and a flexible membrane-like probe card is detachably mounted on the support block so as to cover the recess. The probe card has a main region in which contact elements to be brought into contact with electrode pads of the semiconductor wafer are arranged. A rigid rectangular frame is attached to the rear surface of the probe card so as to surround the main region, thus imparting a flatness to the probe card. A pusher is provided in the recess of the support block so as to be brought into contact with the rear side of the main region of the probe card. The pusher is swingably arranged on the lower end of the shaft vertically supported. The shaft is supported by the support block via two belleville springs.

Claims17

Dependent claims

A probe apparatus for examining an electrical characteristic of an object having a number of electrode pads, comprising:

a work table having a table surface on which said object is placed;
a wiring board provided above said work table, said wiring board comprising a substrate supported by a framework of said probe apparatus and having a high rigidity, and board wiring provided on said substrate and electrically connected to a tester;
a probe card supported by said wiring board, said probe card comprising a flexible and insulating membrane, and flexible card wiring formed on said membrane and electrically connected to said board wiring of said wiring board, said probe card having a main region, in which a plurality of contact elements to be respectively brought into contact with said electrode pads of said object are arranged on a front side opposing to said table surface, and said contact elements being electrically connected to said card wiring;
mounting means for mounting said probe card on said wiring board;
a pusher brought into contact with a rear side of said main region of said probe card, said pusher having a contact surface set such that all of said contact elements are located within a contour thereof,
a shaft engaging with said pusher so as to arrange said pusher swingably on a rear side of said main region of said probe card, said shaft having a center axis which is substantially normal to said table surface;
first and second belleville springs connected to said shaft so as to apply an urging force to the main region of said probe card, and to said contact surface of said pusher, said first and second belleville springs being arranged substantially in parellel with said table surface and separated from each other along the center axis of said shaft;
and securing means, mounted on said wiring board, for securing said first and second belleville springs.

5 more elements

A probe apparatus for examining an electrical characteristic of an object having a number of electrode pads, comprising:

a work table having a table surface on which said object is placed;
a wiring board provided above said work table, said wiring board comprising a substrate supported by a framework of said probe apparatus and having a high rigidity, and board wiring provided on said substrate and electrically connected to a tester;
a support block supported by said wiring board, said support block having a recess arranged such as to oppose said table surface;
first mounting means for mounting said support block to said wiring board;
a probe card supported by said support block, said probe card comprising a flexible and insulating membrane, and flexible card wiring formed on said membrane and electrically connected to said board wiring of said wiring board, said probe card having a main region, in which a plurality of contact elements to be respectively brought into contact with said electrode pads of said object are arranged on a front side opposing to said table surface, said contact elements being electrically connected to said card wiring, and said main region being located so as to cover said recess of said support block;
second mounting means for mounting said probe card on said support block;
a pusher arranged in said recess of said support block so as to be brought into contact with a rear side of said main region of said probe card, said pusher having a contact surface set such that all of said contact elements are located within a contour thereof,
a shaft engaging with said pusher so as to arrange said pusher swingably on a rear side of said main region of said probe card, said shaft having a center axis which is substantially normal to said table surface;
first and second belleville springs connected to said shaft so as to apply an urging force to the main region of said probe card, to said contact surface of said pusher, said first and second belleville springs being arranged substantially in parallel with said table surface and separated from each other along the center axis of said shaft;
and
means, mounted on said support block, for securing said first and second belleville springs.

8 more elements

Dependencies are inferred from the claim text.