Semiconductor device having a layer of gallium amalgam on bump leads
AssigneeLucent Technologies Inc.
InventorsDaniel Flanagan Baldwin, Rajan D. Deshmukh
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Abstract
A semiconductor chip (10) has a plurality of metallized members (12) that are each advantageously bumped with a volume of gallium amalgam (18) to render the members wettable by a conventional solder.
Claims20
An apparatus comprising, in combination, an electronic device comprised of a planar surface having a plurality of non-solder wettable metallized members arrayed on said surface, and a circuit board having a plurality of solder-coated metallized areas arrayed the same as the metallized members on said electronic device for bonding thereto, the improvement wherein said electronic device comprises at least one layer of gallium amalgam on said metallized members and having a pattern corresponding to the array of metallized members to render said members wettable by the solder of the metallized areas on the circuit board.
An electronic device comprising,
- a planar surface having a plurality of non-solder wettable metallized members arrayed on said surface;
- and
- at least one layer of gallium amalgam on said metallized members and having a pattern corresponding to the array of metallized members of said electronic device to render said members solder wettable.
An apparatus comprising, in combination, an electronic device comprised of a planar surface having a plurality of non-solder wettable metallized members arrayed on said surface and a circuit board having a plurality of solder-coated metallized areas arrayed the same as the metallized members on said electronic device for bonding thereto, wherein said electronic device comprises at least one layer of gallium amalgam on said metallized members and having a pattern corresponding to the array of metallized members to render said members wettable by the solder of the metallized areas on said circuit board, and wherein the gallium amalgam contains a titanium barrier compound.
Dependencies are inferred from the claim text.