Method of encapsulating semiconductor devices using a lead frame with resin tablets arranged on lead frame
AssigneeRohm Co., Ltd.
InventorsMasahiro Tsuji, Osamu Miyata
Life of this patent
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Abstract
A method of manufacturing semiconductor devices in which a multi-series lead frame that is constructed so as to assemble semiconductor elements in a state that these elements are arrayed in a plurality of series along the longer sides of the lead frame, is set in a mold, and molding resin is injected into cavities of the mold, to thereby form packages for packing the semiconductor elements in a sealing manner. In the method, a resin tablet is positioned so that resin paths are extended at substantially equal lengths to the cavities on the lead frame set in the mold, and the molding resin is injected into the cavities disposed around the resin tablet by pressing the resin tablet with a plunger.
Claims10
A method of manufacturing semiconductor devices comprising the steps of:
- setting in a mold a lead frame having a construction in which semiconductor elements are arrayed in a plurality of series in a longitudinal direction of the lead frame;
- positioning a resin tablet on the lead frame set in the mold so that resin paths are extended from the resin tablet at substantially equal lengths to a plurality of cavities in the mold;
- and
- injecting molding resin into the cavities through the resin paths to pack the semiconductor elements by pressing the resin tablet.
A method of manufacturing semiconductor devices comprising the steps of:
- setting in a mold a lead frame in which frame units each including a die pad to which a semiconductor element is fastened and a plurality of lead terminals disposed around the die pad are arranged in a plurality of series;
- positioning a resin tablet, on the lead frame set in the mold, at an area of a through-hole formed at a position where resin paths are extended from the resin tablet at substantially equal lengths to a plurality of cavities in the mold;
- and
- injecting molding resin into the cavities through the resin paths to pack the frame units by pressing the resin tablet.
Dependencies are inferred from the claim text.