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US 5,672,549 AGranted
Method of producing epoxy resin-encapsulated semiconductor device
AssigneeSumitomo Bakelite Co., Ltd.
InventorsKatsunori Minami, Hideo Ito
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AssigneeSumitomo Bakelite Co., Ltd.
InventorsKatsunori Minami, Hideo Ito
Estimating the term…
In a method of producing a resin-encapsulated semiconductor device, a lead frame having an semiconductor element bonded thereto and wire-bonded thereto is set as an insert into an injection mold. An epoxy resin molding compound is injected into the mold by an injection molding. In this method, an injection pressure of the injection molding machine is gradually increased in such a manner that a maximum pressure of 30 kg/cm.sup.2 to 300 kg/cm.sup.2 is achieved at the time when 80% to 95% of a total amount of the epoxy resin molding compound to be injected is injected into the mold. Subsequently, the remaining epoxy resin molding compound is injected into the mold at an injection pressure of 20 kg/cm.sup.2 to 100 kg/cm.sup.2. A heating cylinder of the injection molding machine is divided into a plurality of zones which are controlled in the temperature independently. The zone nearest to a nozzle of the heating cylinder is controlled to 65.degree. C.-110.degree. C. while that zone nearest to a hopper of the heating cylinder is controlled to the ordinary temperature to 50.degree. C.
A method of producing a resin-encapsulated semiconductor device by injecting an epoxy resin molding compound into an injection mold, in which a lead frame, to which a semiconductor has been bonded and wire-bonded, is fixedly set as an insert in the injection mold, and by curing such epoxy resin molding compound in said injection mold, the method comprising the steps of:
A method for producing a resin-encapsulated semiconductor device by an injection molding machine by means of injecting an .epoxy resin molding compound into an injection mold in which a lead frame having a semiconductor element mounted thereto and wire-bonded thereto is fixedly set as an insert, said injection molding machine including a cylinder provided at one end thereof with a hopper through which the epoxy resin is supplied into the injection molding machine and at the other end thereof with a nozzle, which cylinder is axially divided into a plurality of sections, wherein each of which sections is to be controlled independently in temperature thereof, and one of said sections most close to said nozzle is maintained at 65.degree. C.-110.degree. C. and one of said sections most close to said hopper is maintained at a room temperature -50.degree. C.
Dependencies are inferred from the claim text.