US 5,672,414 AGranted

Multilayered printed board structure

AssigneeFuji Electric Co., Ltd.

InventorsKenji Okamoto, Yukio Nakajima, Kazuhiko Imamura, Takao Ichihara

Life of this patent

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Abstract

A metallic printed board is formed by laminating an insulation layer on the surface of a metallic sheet as a base, and then electronic parts are mounted on the conductor pattern formed on the surface of the insulation layer. A double-sided printed board mounted thereon electronic parts is placed in parallel. Both the printed boards are supported and fixed monolithically by filling the space between the printed boards with an insulation resin and curing the resin. Furthermore, an insulation resin is laminated on the surface of the printed board in such a manner that the resin may cover the mounted electronic parts, and cured. The heat generated from the electronic parts can be efficiently transmitted to the insulation resins by using a resin having a high thermal conductivity for both of the insulation resins, and the heat is then emitted from the surfaces of the metallic sheet or the insulation resin.

Claims24

Dependent claims

A multilayered printed board structure, comprising:

an insulated metal substrate including an insulating layer laminated on a metallic plate as a base layer and a conductive layer on said insulating layer, and having first electronic components mounted on said insulated metal substrate;
at least one printed board laminated over a first side of said insulated metal substrate on which said first electronic components are mounted, and having second electronic components mounted on one or both sides of said printed board;
an insulating resin filling a space between said insulated metal substrate and said printed board;
said printed board or said insulation layer of said insulated metal substrate being divided into at least first and second portions, said first portion containing electronic parts similar in first operational characteristics;
and
said second portion containing parts similar in second operation characteristics, said first and second operational characteristics being different;
and
said portions of said printed board or said insulating layer formed of materials differing in physical properties and selected in relation to the operational characteristics of said electronic parts of said portion.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 08/263,332Filed 21 Jun 1994
Priority: JP 5-18083625 Jun 1993
Granted: 30 Sep 1997
Term ends: Not estimatedThe source records don’t support an estimate.

Classification27 codes

B32B 3/00
Layered products comprising a layer with external or internal discontinuities or unevennesses
H05K 1/141
Structural association of two or more printed circuits: one or more single auxiliary printed circuits mounted on a main printed circuit, e.g.…
H05K 1/144
Structural association of two or more printed circuits: stacked arrangements of planar printed circuit boards
H05K 1/147
Structural association of two or more printed circuits: at least one of the printed circuits being bent or folded, e.g. by using a flexible…