Insulating boards and method of manufacturing the same
AssigneeSumitomo Electric Industries, Ltd.
InventorsKeizo Harada, Kenichi Watanabe, Shosaku Yamanaka
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Abstract
An insulating board having a substrate, and an insulating film of silicon oxide formed on the surface of the substrate by vapor phase deposition. In forming the film, the forming conditions are controlled so that the film is formed in an overhang or conformal shape at initial stage and then in a flow shape. Thereby, both good adhesion and excellent insulation properties are achieved.
Claims4
An insulating board comprising a substrate, and an insulating film of silicon oxide formed on the surface of said substrate by vapor phase deposition using an organic silicone as a reaction source gas, where at the corners of each recess of the substrate, said insulating film is accumulated with an angle .theta., which is shown in FIGS. 1A and 1B and defines the step coverage of the film, varying continuously or in steps from .theta..ltoreq.0 to .theta.>0 and from the interface with said substrate toward the surface of the insulating board, and wherein the adhesion strength of said insulating film to said substrate is 50 kgf/cm.sup.2 or higher, and the leakage current density of said insulating film is 10.sup.-8 A/cm.sup.2 or lower.
Dependencies are inferred from the claim text.