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US 5,672,400 AGranted
Electronic assembly with semi-crystalline copolymer adhesive
AssigneeMinnesota Mining and Manufacturing Company
InventorsDennis D. Hansen, Michael A. Kropp, Glen Connell
Life of this patent
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Abstract
The present invention provides a microelectronic assembly wherein a semi-crystalline copolymer adhesive composition, preferably provided in the form of a film, is used to electrically interconnect a first circuit pattern on a first substrate to a second circuit pattern on a second substrate. The adhesive composition preferably includes a semi-crystalline copolymer comprising polyether and polyamide monomeric units, a tackifier, and conductive particles.
Claims2
An electronic assembly, comprising:
- (a) a first substrate with at least one first conductive bonding site;
- (b) a second substrate with at least one second conductive bonding site;
- and
- (c) a polymeric adhesive composition between said first and second substrates and said first and second bonding sites, wherein the adhesive composition, measured by DMA at 1 rad/second, has a ratio of loss modulus (G") to storage modulus (G'), tan .delta.=1, at a temperature of about 90.degree. C. to about 150.degree. C., and wherein at the temperature where tan .delta.=1, the adhesive composition has a storage modulus (G') of less than about 2.times.10.sup.5 dynes/cm .sup.2 ;
- and, at a temperature 20.degree. C. below the temperature where tan .delta.=1, the adhesive composition has a storage modulus (G") greater than about 5.times.10.sup.5 dynes/cm.sup.2, and wherein the T.sub.g of the adhesive composition is about -10.degree. C. to about 40.degree. C.
2 more elements
Dependencies are inferred from the claim text.