Method for engraving three dimensional images

A simplified method of producing a smoothly graduated, three dimensional engraving in a substrate, comprising:

• providing an image which is desired to be engraved in three dimensional fashion into a substrate;
• preparing a transparency of said desired image, wherein said transparency has varying levels of tone that represent the varying levels of depth required in the desired image;
• providing a resist film having a photosensitive resist layer and a base layer;
• processing the resist film to impart a three dimensional version of the desired image onto the resist layer, said processing step including the steps of:
• exposing the resist layer to a radiation source that is directed through both the transparency and the base layer into the resist layer for a specific quantity of exposure, whereby the varying levels of tone of the transparency result in controlled differential exposure of the resist layer to the radiation source, whereby said differential exposure to the radiation source results in variable thickness hardening of specific areas of the resist layer according to the various levels of light to which it is exposed;
• processing the resist layer to remove unhardened areas of the top layer, thereby resulting in smoothly varying levels of thickness in the resist layer that correspond to a three dimensional version of the desired image;
• bonding the resist layer to the substrate;
• and
• shotblasting the resist layer, whereby the smoothly varying levels of thickness of the resist layer give the resist layer differential resistance to the shotblasting process, whereby as the shotblasting process proceeds, the thinner areas of the resist layer are progressively worn away, exposing more and more of the substrate to the action of the shot and thus producing a controlled and smoothly graduated three dimensional cut into the substrate, thereby producing a three dimensional version of the desired image in the substrate.

A simplified method of producing a smoothly graduated, three dimensional engraving in a substrate, comprising:

• providing an image which is desired to be engraved in three dimensional fashion into a substrate;
• preparing a transparency of said desired image, wherein said transparency has varying levels of tone that represent the varying levels of depth required in the desired image;
• providing a resist film having a photosensitive resist layer and a base layer;
• processing the resist film to impart a three dimensional version of the desired image onto the resist layer, said processing step including the steps of:
• exposing the resist layer to a radiation source that is directed through both the transparency and the base layer into the resist layer for a specific quantity of exposure, whereby the varying levels of tone of the transparency result in controlled differential exposure of the resist layer to the radiation source, whereby said differential exposure to the radiation source results in variable thickness hardening of specific areas of the resist layer according to the various levels of light to which it is exposed;
• processing the resist layer to remove unhardened areas of the top layer, thereby resulting in smoothly varying levels of thickness in the resist layer that correspond to a three dimensional version of the desired image;
• applying a liquid carrier film to the resist layer;
• removing the base layer from the resist layer;
• bonding the resist layer to the substrate;
• removing the carrier film from the resist layer;
• and
• shotblasting the resist layer, whereby the smoothly varying levels of thickness of the resist layer give the resist layer differential resistance to the shotblasting process, whereby as the shotblasting process proceeds, the thicker areas of the resist layer are progressively worn away, exposing more and more of the substrate to the action of the shot and thus producing a controlled and smoothly graduated three dimensional cut into the substrate, thereby producing a three dimensional version of the desired image in the substrate.