Elimination of pad conditioning in a chemical mechanical polishing process
AssigneeIntel Corporation
InventorsSeiichi Morimoto, Ebrahim Andideh
Life of this patent
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Abstract
A method and apparatus for polishing a film formed over a semiconductor substrate. The substrate is pressed up against an abrasive pad so that the film contacts the pad. The pad has a diameter which is less than approximately two times a diameter of the substrate. While pressure is applied to the back of the substrate, the pad is rotated with respect to the wafer and an abrasive ceria slurry is introduced onto the pad to polish the film.
Claims26
A method of polishing a film formed over a semiconductor substrate comprising the steps of:
- a) forcibly pressing the substrate against an abrasive pad such that the film is placed in contact with the pad, the pad having a diameter which is less than approximately two times a diameter of the substrate;
- b) introducing an abrasive slurry comprising ceria onto the pad;
- and
- c) rotating the pad with respect to the substrate to polish the film at an etch rate.
A method of polishing a film formed over a semiconductor substrate comprising the steps of:
- a) breaking in an abrasive polishing pad by polishing a dummy wafer using an abrasive slurry comprising ceria;
- b) introducing an abrasive slurry comprising ceria onto the pad;
- c) forcibly pressing the substrate against the pad such that the film is placed in contact with the pad, the pad having a diameter which is less than or equal to two times a diameter of the substrate, the film comprising an oxide;
- and
- d) rotating the pad with respect to the substrate to polish the film at an etch rate, the pad remaining essentially unconditioned during the polishing of the film.
An apparatus for polishing a film formed over a semiconductor substrate comprising:
- a carrier to which the substrate is attached, the carrier forcibly pressing the film in contact with an abrasive pad;
- a table to which the pad is attached, the pad having a diameter which is less than approximately two times a diameter of the substrate;
- a slurry distribution system which saturates the pad with a slurry comprising ceria;
- and
- a motor coupled to the table, the motor rotating the table and pad.
Dependencies are inferred from the claim text.