Fabrication of flat panel device having backplate that includes ceramic layer

A method which comprises the following steps for manufacturing a flat panel device:

• combining a plurality of layers, including a ceramic first layer, to form a laminated structure;
• firing the laminated structure to convert the layers into an integral backplate substrate, at least part of which constitutes a backplate;
• applying glazing material across the backplate;
• heating the glazing material to a glazing temperature sufficiently high to fuse the glazing material over the backplate;
• and
• fabricating a flat panel structure that comprises the backplate, (b) a faceplate connected to the backplate to form a sealed enclosure, (c) a field emitter cathode for emitting electrons, (d) light-emitting means for emitting light upon being struck by electrons emitted from the field emitter cathode, and (e) means for controlling the field emitter cathode.

A method which comprises the following steps for manufacturing a flat panel device:

• combining a plurality of layers, including a ceramic first layer, to form a laminated structure;
• firing the laminated structure to convert the layers into an integral backplate substrate, at least part of which constitutes a backplate;
• providing the backplate with cooling channels suitable for transporting cooling fluid;
• and
• fabricating a flat panel structure that comprises the backplate, (b) a faceplate connected to the backplate to form a sealed enclosure, (c) means for producing light, and (d) means for controlling the light-producing means.

A method which comprises the following steps for manufacturing a flat panel device:

• combining a plurality of layers, including a ceramic first layer, to form a laminated structure;
• firing the laminated structure to convert the layers into an integral backplate substrate, at least part of which constitutes a backplate;
• forming openings in the backplate;
• creating a field emitter cathode which occupies the openings in the backplate;
• furnishing means for controlling the field emitter cathode;
• providing a faceplate, including light-emitting means situated along the faceplate for emitting light upon being struck by electrons;
• and
• connecting the faceplate to the backplate to form a sealed enclosure.