Integrated container moulding and filling facility

An integrated method of making containers for ultra-high purity chemicals used in the fabrication of semiconductor wafers comprising

• forming molded containers,
• testing said containers for leaks with injected highly filtered air, exposing said newly formed containers to ionized air, conveying said containers to a filling area, exposing said containers to ionized air while conveying said containers, and
• filling said containers with ultra-high purity chemicals, all steps occurring in an environment maintained free of contamination according to semiconductor manufacturer standards which are defined as a resistivity of ultra pure water of at least 18 megohm-cm at 25.degree. C., less than about 25 ppb of electrolytes other than said ultra-high purity chemical itself, a particulate content of less than 150/ml and a particle size less than 0.2 micron, a microorganism content less than 10/ml and total organic carbon less than 100 ppb.