Fabrication process for circuit substrate having interconnection leads

A method for producing an apparatus that includes a print circuit board, said method comprising the steps of:

• (a) forming a plurality of circuit regions on a single master print circuit board such that each of said plurality of circuit regions includes a conductor pattern for the print circuit board of said apparatus, each of said plurality of circuit regions having a pad electrode thereon;
• (b) forming a lead frame structure including a lead frame body having a plurality of lead frame regions, each lead frame region having an interconnection leads with each interconnection lead corresponding to a pad electrode, the interconnection leads extending from said lead frame body as an integral part therein;
• (c) connecting each interconnection lead to the corresponding pad electrode while the circuit regions are mechanically connected with each other in the form of said master print circuit board, each interconnection lead being connected to the corresponding pad electrode by attaching said lead frame structure to said master print circuit board such that, in each of said lead frame regions, said interconnection lead is soldered to the corresponding pad electrode of the print circuit region;
• and
• (d) dividing said master print circuit board, after said step (c), to thereby separate the circuit regions and form individual printed circuit boards.