US 5,671,525 A · Method of manufacturing a hybrid chip card

Abstract

A method of manufacturing a hybrid chip card comprises the steps of providing a card body; forming a cavity in the card body; mounting the electronic module in the cavity of the card body; and connecting an antenna to the electronic module. The cavity opens out on a face of the card body and is adapted for receiving an electronic module. The electronic module includes an integrated circuit chip. The mounting step further includes the step of exposing a plurality of contact pads of the electronic module on the outer surface of the card. The plurality of contact pads permit contact communication between the electronic module and the chip card reader, and the antenna permits contact-free communication between the electronic module and the chip card reader. The hybrid chip card thus manufactured is capable of both contact and contact-free communication with a chip card reader.

Claims15

Dependent claims

A method of manufacturing a chip card, the method comprising the steps of:

attaching an antenna to a lower thermoplastic sheet, the antenna having two contact terminals;
covering the antenna with an upper thermoplastic sheet, the upper thermoplastic sheet and the lower thermoplastic sheet forming a chip card body, the upper thermoplastic sheet having a cavity formed therein such that, after the antenna is covered with the upper thermoplastic sheet, the cavity reveals the two contact terminals of the antenna and the cavity opens out on a face of the chip card body;
and then mounting an electronic module in the cavity of the chip card body, the electronic module having two contact zones connected to an integrated circuit, and connecting the two contact zones of the electronic module to the two contact terminals of the antenna.

A method of manufacturing a hybrid chip card, the hybrid chip card being capable of both contact and contact-free communication, the method comprising the steps of:

providing a card body;
forming a cavity in the card body, the cavity opening out on a face of the card body and being adapted for receiving an electronic module;
mounting the electronic module in the cavity of the card body, the electronic module including an integrated circuit chip, the mounting step further including the step of exposing a plurality of contact pads of the electronic module on the outer surface of the card, the plurality of contact pads permitting contact communication between the electronic module and a first chip card reader;
and,
connecting an antenna to the electronic module, the antenna permitting contact-free communication between the electronic module and a second chip card reader;
and wherein the electronic module is mounted in the cavity and connected to the antenna after the card body is provided and the cavity is formed.

3 more elements

Dependencies are inferred from the claim text.

Method of manufacturing a hybrid chip card

Life of this patent

Method of manufacturing a hybrid chip card

Life of this patent

Abstract

Claims15