Inverter unit and inverter apparatus

An inverter apparatus comprising:

• a plurality of inverter units for converting a DC current to a high frequency AC current, each inverter unit comprising a metal conductor base plate connected to a positive terminal of a DC power supply and having a pair of opposed ends parallel to one another;
• and two arm pairs arranged on both surfaces of the base plate for constituting a single phase bridge circuit, each arm pair being situated on each surface of the base plate and including an upper arm, a lower arm, two switching elements, and one conductor for connecting the two switching element together in series, one of the switching elements being directly connected to the base plate and the other of the switching elements contacting the base plate through an electric insulator and being connected to a negative terminal of the DC power supply;
• a case for mounting therein the inverter units;
• a plurality of pairs of opposed guide rails for holding the inverter units between the respective pairs of the guide rails, said metal conductor base plate being held between a pair of the guide rails through the parallel ends;
• and
• a bus laminate having a plurality of conductors and an insulator Situated between two of the conductors for insulating the conductors, said bus laminate being connected with the inverter units when the inverter units are mounted in the case.

An inverter unit for converting a DC current to a high frequency AC current comprising:

• a metal conductor base plate adapted to be connected to a positive terminal of a DC power supply;
• and
• switching elements arranged on both surfaces of the base plate, each switching element situated on each surface of the base plate including an upper arm and a lower arm of the inverter unit to form an arm pair, said arm pairs formed on both surfaces of the base plate constituting a single phase bridge circuit, each arm pair of the inverter unit formed on one of the surfaces of the metal conductor base plate comprising:
• a first thin metal conductor adapted to be connected to a negative terminal of the DC power supply;
• a second thin metal conductor having a step dividing the second conductor to a first part contacting with the first conductor through an electric insulator and a second part contacting with the base plate through an electric insulator, and
• first and second flat semiconductor elements, said first flat semiconductor element being sandwiched between the first part of the second conductor and the base plate, and said second flat semiconductor element being sandwiched between the second part of the second conductor and the first conductor so that the first and second flat semiconductor elements are connected in series through the second conductor, which are disposed between the base plate and the first metal conductor, and contacting faces of the base plate, the first and second conductors and the first and second flat semiconductor elements are pressed.

An inverter unit for converting a DC current to a high frequency AC current comprising:

• a metal conductor base plate adapted to be connected to a positive terminal of a DC power supply and having holes therein to allow a coolant to flow therethrough to cool the base plate;
• and
• switching elements arranged on both surfaces of the base plate, each switching element situated on each surface of the base plate including an upper arm and a lower arm of the inverter unit to form an arm pair, said arm pairs formed on both surfaces of the base plate constituting a single phase bridge circuit, each arm pair of the inverter unit formed on one of the surfaces of the metal conductor base plate comprising:
• a first thin metal conductor adapted to be connected to a negative terminal of the DC power supply,
• a second thin metal conductor having a step dividing the second conductor to a first part contacting with the first conductor through an electric insulator and a second part contacting with the base plate through an electric insulator,
• a first flat semiconductor element sandwiched between the first part of the second conductor and the base plate,
• a second flat semiconductor element, and
• a thick conductor plate having holes to allow a coolant to flow therethrough, said thick conductor plate and the second flat semiconductor element being sandwiched between the second part of the second conductor and the first conductor so that the first and Second flat semiconductor elements are connected in series through the second conductor, which are disposed between the base plate and the first metal conductor, and contacting faces of the base plate, the first and second conductors, the first and second flat semiconductor elements and the thick conductor plate are pressed.