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US 5,670,826 AGranted
Method for mounting a semiconductor device on a circuit board using a conductive adhesive and a thermosetting resin, and a circuit board with a semiconductor device mounted thereon using the method
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsYoshihiro Bessho, Yoshihiro Tomura
Life of this patent
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Abstract
A method for mounting a semiconductor device on a circuit board which includes the steps of: joining a terminal electrode of the semiconductor device to a connecting electrode of the circuit board by means of a thermoplastic conductive adhesive; allowing a thermosetting resin to fill a gap between the semiconductor device and the circuit board; and curing the thermosetting resin at a temperature equal to or higher than the plasticizing temperature of the thermoplastic conductive adhesive is disclosed.
Claims7
A circuit board with a semiconductor device mounted thereon, comprising:
- a joining layer formed of a thermoplastic conductive adhesive between a terminal electrode of the semiconductor device and a connecting electrode of the circuit board;
- and
- a resin layer formed of a thermosetting resin between the semiconductor device and the circuit board,
- wherein the joining layer and the resin layer are both formed prior to a curing step, and then the thermosetting resin is cured at a temperature equal to or higher than a plasticizing temperature of the thermoplastic conductive adhesive.
1 more element
Dependencies are inferred from the claim text.